StarTech.com High-Performance Silicone Thermal Paste, Grease Compound for CPUs, GPUs, and ICs, Improves Heat Dissipation
StarTech.com High-Performance Silicone Thermal Paste, 14.5W/m•K Conductivity, Grease Compound for CPUs, GPUs, and ICs, Improves Heat Dissipation in Computers. Type: Thermal paste, Thermal conductivity: 14.5 W/m·K, Constitutive ingredients: Aluminium oxide, Silicone, Zinc oxide. Width: 26.6 mm, Depth: 126 mm, Height: 17.2 mm. Quantity per pack: 1 pc(s), Package width: 160 mm, Package depth: 60 mm. Master (outer) case width: 500 mm, Master (outer) case length: 330 mm, Master (outer) case height: 255 mm
High-performance silicone thermal paste improves heat transfer for CPUs processors GPUs and ICs in computer system - 14.5W m-K conductivity with an operating temperature range from -58F to +536F (-50C to +280C) - Non-conductive compound prevents shorts for safe operation - Resealable 10g syringe design prevents spills and allow easys reuse - Plunger ensures clean controlled application of the thermal grease during builds upgrades and maintenance
Performance Thermal Paste - 10g
Improve cooling performance in workstations, servers, and compact systems with this high-performance thermal paste, designed for efficient heat transfer and safe application in professional environments.
Reliable Thermal Transfer for Demanding Systems
Silicone-based thermal compound features a thermal conductivity of 14.5 W/m • K and an operating range of -58°F to +536°F (-50°C to +280°C); helping maintain thermal stability in CPUs, GPUs, and ICs with high TDP under continuous load.
Safe for Sensitive Components
Electrically non-conductive grease helps prevent shorts, supporting safe use in spaced constrained or critical system builds.
Precise and Reusable Application
Includes a resealable 10g syringe with screw cap and plunger for controlled, repeatable use in upgrades, repairs, or custom builds.
English
